Job Description

Designation

Technical Lead

No. of Positions

1

Experience

7-9 Years

Skill (Primary)

Technical Skills (ERS)-HW PCB Advanced-High Speed PCB design practices

Qualification

B.E

Job Family

Engineering (Engineering - Hardware)

(Posting).

IC Package Layout Design Engineer Experience with PCB Design and IC Package Design using Mentor Graphics XPD, XSI tools and/or Cadence Allegro APD Engineer must be able to optimize the PCB and Ballmap quadrants to meet product floorplan Engineer must be able to come-up with different Ball Patterns, Board BO and PTH patterns and must suggest alternate Ballmap options to meet electrical specs Must have experience of delivering at least 6 high density PCB designs with engagement from planning, pathfinding phase to Board Tape Out. The engineer must have a hands-on experience of early Path Finding activities for any complex, high density product designs including Laptop, Desktop Mother board or Server Boards. The engineer is responsible for the PCB Path Finding and Optimizing the Ballmap for Intel GPUs. He must also support Package Design activities when needed Mindset to swiftly change multiple roles including PCB PF, Route study, Ballmap development and PKG design is mustIC Package design / Substrate design experience is mandatoryShould be able to work with customer SPOC independentlyShould have experience in all phases of PCB/Package design phases (from net-in to Gerber generation) (1.) To be responsible for providing technical guidance or solutions (2.) To develop and guide the team members in enhancing their technical capabilities and increasing productivity (3.) TO ensure process compliance in the assigned module, and participate in technical discussionsorreview. (4.) To prepare and submit status reports for minimizing exposure and risks on the project or closure of escalations.