Job Description

Description:

• Experience in design for manufacturing (DFM) including plastic injection molding, metal casting, machining, stamping, and forming
• Experience in electronic board design
• Experience in electronic board design
• Experience in leading full life cycle projects
• Experience with PLM systems, engineering changes, BOM structuring, etc.
• Experience in design of indoor and outdoor equipment
• Experience in thermal, dynamical and statical design and analysis
• Experience in design of telecommunication/RF equipment - an advantage
• Perform analysis, testing, design iterations and validation of the designs
• Proficiency in SolidWorks

Requirements:

• BSc in Mechanical Engineering .
• At least 10 years of experience in electronics packaging design
• At least 5 years experience as a team leader.
• Strong understanding of GD&T, drawings, assembly tolerances
• Team player with strong technical and communication skills

• At least 3 years of experience leading a team - leader position.

Skills Required