Job Description

BU / Function

Digital Data & Networks (DDN) Business Unit in TE Connectivity, where we enable high-speed connectivity solutions that power today's and tomorrow's data-driven world. Engineering team is responsible for development of innovative interconnect solution products which are used in hyperscale computers, AI, Datacenter, Cloud server, and other IT systems, including connector, cable assembly, bus bars and sockets. We engineer and manufacture cutting-edge interconnect solutions that support high-speed data transmission, signal integrity, and power efficiency.

Role Objective

Sr. Manager is a senior engineering leader for high-speed PCB Design and Simulations. They lead teams in designing, simulating, and validating high-performance high speed printed circuit boards for AI and Datacentre applications ensuring quality, performance, and manufacturability through strategic planning, technical guidance, and collaboration across cross-functional teams. Responsibilities include team development, design and simulation strategy, project management, and continuous process improvement to meet deadlines, budget targets, and project performance goals.


Responsibilities:

Team Leadership & Development:

Lead, mentor, and develop teams of high-speed PCB design and simulation managers and engineers, focusing on their career growth and skill development.

Strategic Design and Simulation:

Define and implement high speed design and simulation roadmaps, methodologies and best practices for signal integrity, power integrity, electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal analysis.

Cross-Functional Collaboration:

Work closely with hardware, firmware, mechanical, and manufacturing teams to translate requirements into viable designs and resolve issues.

Project & Resource Management:

Oversee the management of multiple complex PCB design and simulation projects, ensuring they meet deadlines, budget requirements, and performance targets.

Technical Oversight:

Provide technical guidance on PCB layout, schematic creation, and component selection, staying current with new technologies and design standards.

Design review and verifications

: Conduct design and simulation reviews, providing strategic recommendations to optimize PCB performance and reliability.

Continuous improvement

: Drive innovation and improvement in high-speed PCB design and simulation process. Stay current with emerging technologies, design standards (e.g. IPC), and simulation tools to enhance efficiency and maintain a competitive edge.

Quality and Validation

: lead and drive accuracy in design and simulations, conduct design of experiments (DoE), plausibility check and sensitivity study of simulations, validate simulation results with experimental data, and design optimizations for first time right manufacturability (prototypes and mass production).

Candidate Desired Profile:

Education

: A bachelor's degree in electrical or electronics engineering from a premier institute/university. A

master's degree

in a related field is preferred.

Experience:

20 yrs extensive hands-on experience in high-speed PCB design and simulation with a proven track record of delivering complex projects.

Leadership:

8-10 years progressive leadership or management experience in leading and developing high-performing engineering teams. Experience in customer engagement and stakeholder management is essential.

Technical Skills:

Deep understanding of engineering principles for high-speed PCB design, signal integrity (SI), power integrity (PI), electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal incidents. Deep understanding of PCB layout, schematic creation, routing, and manufacturability. Expertise in high-speed PCB design tools such as Altium Designer, Allegro or PADS. Expertise in high-speed PCB simulation tools for electrical and thermal analysis - Ansys SIwave/HFSS, Keysight Pathwave ADS, Keysight SIPro, Siemens HyperLyx, Cadence Sigrity, Dassault CST Studio Suite, Ansys EMC Plus, Cadence Microwave Office, and Ansys ICEPAK/Siemens FLOTHERM/Cadence CELSIUS. Strong knowledge of industry standards (IPC, JEDEC, PCIe, USB, Ethernet) and PCB manufacturing processes, including design for manufacturability (DFM).

Soft Skills:

Proven abilities on inspiring leadership, team management, prioritisation, strategy and execution. Experience in organizational development, and talent attraction/management/retention. Promote and manage employee wellbeing and work-life balance. Passion for Technology and scientific/engineering excellence. Excellent problem-solving and analytical skills to resolve complex technical issues. Strong in Technical Documentations, Report preparation and presentation Strong verbal and written communication skills to articulate complex technical concepts to both technical and non-technical stakeholders. Ability to work effectively in a fast-paced, collaborative global environment and global time zones. Proficient using MS office software (Word, Excel, PPT, Outlook, MS Teams, etc.).

What your background should look like

Generally requires Bachelors degree in appropriate field with 12 or more years of experience; or Masters with 10 or more years of experience; or PhD level with 6 or more years of experience; or local equivalent

Competencies

SET : Strategy, Execution, Talent (for managers)

Job Locations:

Bangalore, Karn?taka 560066

India

Travel Required:

10% to 25%

Requisition ID:

140967

Workplace Type:

External Careers Page:

Engineering & Technology