Executes complex simulations in CFD and Thermal to optimize design and manufacturing. Develops complex Multiphysics simulation methods that meets design requirements in thermal management of Electronic Systems, especially in high-speed transceivers, connectors, and their assemblies.
KEY RESPOSBILITIES:
5 to 8 years of industry experience.
Expertise in Ansys Workbench.
Experience on connector products (Plastic and Sheet Metal parts).
Knowledge on material science (Metals, Resins & hyper elastic material) and implement for simulation.
Expertise on CAE tools, Optimization techniques, and testing methods.
Development & execution of complex Thermal simulation models to optimize manufacturing, designs or processes for high-speed IO products in data center, telecom and allied applications.
Perform calculation & simulation on temperature distribution over system.
Proficient in simplifying complex CAD geometries for efficient structural and thermal simulation analyses
In-depth knowledge of mechanical design, conductive, convective, & radiation heat transfer, and fluid flow mechanics.
Collaborate with designer, manufacturing, and testing teams to correlate CFD & Thermal Simulation results with physical testing
Experience with DOE (Design of Experiments) and optimization techniques
Ensuring the maintenance and updating of simulation models to achieve optimal accuracy and relevance.
Execute CFD Techniques - steady, transient, conjugate heat transfer, internal & external flows, electronics cooling, electro-thermal analysis using Software tools like Ansys Work Bench, Fluent, CFX, Icepak, AEDT, Q3D etc.
Translate actual problem to Thermal model, interpret analysis results and select best solution.
Monitor and evaluate simulation software capabilities and industry trends.
Collaborate with design & validation teams to enhance the design optimization.
Understanding the influence/impact activities on financial decision.
DESIRED SKILL:
5 to 8 years of industry experience.
Expertise in Ansys Workbench.
Experience on connector products (Plastic and Sheet Metal parts).
Knowledge on material science (Metals, Resins & hyper elastic material) and implement for simulation.
Expertise on CAE tools, Optimization techniques, and testing methods.
Development & execution of complex Thermal simulation models to optimize manufacturing, designs or processes for high-speed IO products in data center, telecom and allied applications.
Perform calculation & simulation on temperature distribution over system.
Proficient in simplifying complex CAD geometries for efficient structural and thermal simulation analyses
In-depth knowledge of mechanical design, conductive, convective, & radiation heat transfer, and fluid flow mechanics.
Collaborate with designer, manufacturing, and testing teams to correlate CFD & Thermal Simulation results with physical testing
Experience with DOE (Design of Experiments) and optimization techniques
Ensuring the maintenance and updating of simulation models to achieve optimal accuracy and relevance.
Execute CFD Techniques - steady, transient, conjugate heat transfer, internal & external flows, electronics cooling, electro-thermal analysis using Software tools like Ansys Work Bench, Fluent, CFX, Icepak, AEDT, Q3D etc.
Translate actual problem to Thermal model, interpret analysis results and select best solution.
Monitor and evaluate simulation software capabilities and industry trends.
Collaborate with design & validation teams to enhance the design optimization.
Understanding the influence/impact activities on financial decision.
Competencies
SET : Strategy, Execution, Talent (for managers)
Job Locations:
Bangalore, Karn?taka 560066
India
Travel Required:
10% to 25%
Requisition ID:
139655
Workplace Type:
External Careers Page:
Engineering & Technology
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