Senior Assembly Process Engineer Wafer Dicing

Year    India, India

Job Description


Our vision is to transform how the world uses information to enrich life for . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. JR39132 Senior Assembly Process Engineer - Wafer Dicing (Evergreen) As a Wafer Dicing Process Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify , diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC methodology . Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives . Responsibilities and Tasks : . Evaluate and Improve Wafer Dicing Assembly Processes, Materials, and/or Equipment Maintain in-depth process knowledge . Maintain materials and equipment knowledge as it relates to the process and how they interact . Optimize process and/or equipment variables by apply DOE techniques . Maintain knowledge of material attributes (shelf life, storage requirements, etc.) . Define process edges and center the process (CPK) . Determine root cause and implement corrective actions . Define and maintain operation procedures Requirements: 1) Bachelor\'s or Master degree in Electronic, Mechanical, Mechatronic or related Engineering 2) Min 5 years related experience in Assembly packaging or Semiconductor manufacturing background 3 ) Possess good knowledge in Wafer Dicing Processes 5 ) Familiar with Failure Mode Effects Analysis (FMEA), Statistical Process Control (SPC) and Problem solving skills 6) Knowledge in Design Of Experiment (DOE) will be an added advantage 7 ) Self-motivated, possess initiative and ability to work independently 8 ) Team player with good communication and interpersonal skills Location : Sanand, Ahmedabad, Gujarat

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Job Detail

  • Job Id
    JD3109369
  • Industry
    Not mentioned
  • Total Positions
    1
  • Job Type:
    Full Time
  • Salary:
    Not mentioned
  • Employment Status
    Permanent
  • Job Location
    India, India
  • Education
    Not mentioned
  • Experience
    Year