We are seeking a skilled PCB Designer with strong experience in designing high-speed, multi-layer PCBs for automotive embedded systems such as Digital Clusters, IVI Systems, Telematics ECUs, and Power Electronics modules. The ideal candidate should be proficient in PCB CAD tools, understand automotive design rules, and be capable of collaborating closely with hardware engineers to deliver EMI/EMC-compliant and production-ready PCB layouts.
Perform high-speed PCB layout for interfaces such as LPDDR, eMMC, Ethernet (RGMII/RMII), MIPI DSI/CSI, USB, CAN, LIN, SPI, and RF sections.
Proficient in Altium Designer, OrCAD PCB Editor, Cadence Allegro, or equivalent PCB EDA tools.
Strong knowledge of: High-speed signal routing, Impedance-controlled stack-up, Power distribution network design, RF layout (BLE/WiFi/LTE/GNSS), High-current power electronics routing
Experience with Gerber generation, fabrication files, drill files, and 3D model integration.
Understanding of IPC standards (IPC-2221, IPC-7351, IPC-610)
Create PCB stack-up in collaboration with fabrication vendors, ensuring impedance-controlled routing.
Execute differential pair routing, length matching, skew control, and impedance calculations for high-speed nets.
Perform placement & routing considering thermal, mechanical, and electrical constraints.