To safely and effectively remove potting materials from electronic components or assemblies for the purpose of inspection, repair, analysis, or rework, while maintaining the integrity of the underlying components.
Key Responsibilities
Remove potting compounds (epoxy, silicone, polyurethane, etc.) from electronic devices using mechanical, thermal, or chemical methods.
Interpret technical drawings, work instructions, or engineering requests to perform targeted removal without damaging sensitive components.
Use tools such as scalpels, ultrasonic cleaners, heat guns, or chemical baths in a safe and controlled manner.
Document procedures, issues encountered, and condition of components post-removal.
Coordinate with Engineering or Quality teams to determine potting removal feasibility and limitations.
Follow ESD safety protocols and handle components per IPC standards.
Maintain cleanliness and safety of the work area, including handling of hazardous materials.
Requirements
ITI / Diploma in Electronics / Electrical Engineering or related field.
Job Type: Contractual / Temporary
Contract length: 6 months
Pay: ?8,086.00 - ?15,206.83 per month
Schedule:
Day shift
Work Location: In person
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