Job Description

Experience in design for manufacturing (DFM) including plastic injection molding, metal casting, machining, stamping, and forming Experience in electronic board design Experience in electronic board design Experience in leading full life cycle projects Experience with PLM systems, engineering changes, BOM structuring, etc. Experience in design of indoor and outdoor equipment Experience in thermal, dynamical and statical design and analysis Experience in design of telecommunication/RF equipment - an advantage Perform analysis, testing, design iterations and validation of the designs Proficiency in SolidWorks


Requirements:


BSc in Mechanical Engineering . At least 10 years of experience in electronics packaging design At least 5 years experience as a team leader. Strong understanding of GD&T, drawings, assembly tolerances Team player with strong technical and communication skills * At least 3 years of experience leading a team - leader position.