Job Description

Responsible for the end-to-end design and development of parts and assemblies used in Semiconductor Wafer Fabrication Equipment (WFE). This includes translating engineering concepts into detailed designs supported by validation and testing. Lead engineering projects involving mechanical structures, thermal systems, and fluid delivery systems, using analytical calculations, engineering modeling, and standard design practices. Perform detailed analyses of part and assembly functionality to define performance requirements, ensure compliance with specifications, and implement design optimizations that enhance functionality, reliability, and manufacturability. Develop engineering solutions using strong knowledge of materials and metal additive manufacturing (AM) technologies. Apply DfAM principles, AM design rules, and considerations for manufacturing capabilites to ensure parts can be effectively produced. Evaluate and recommend suitable materials, machines, and post-processing steps based on supplier capabilities and manufacturing constraints. Support the entire validation cycle by designing experiments, planning and conducting lab or bench-level tests, and performing data analysis to drive informed design iterations. Actively contribute to lab testing activities to assess design feasibility and performance. Prepare and release engineering drawings, specifications, and Bills of Materials (BOMs) in alignment with the Engineering Change Management (ECM) process. Ensure all documentation reflects the latest design revisions and quality standards. Collaborate closely with Product Engineering, subject-matter experts (SMEs), and cross-functional teams across global locations to advance the design and development cycle through prototype readiness, hardware testing, and production qualification. Represent and defend design solutions during formal design reviews, working in alignment with global stakeholders and cross-functional teams to achieve full qualification of parts and assemblies. Provide clear and comprehensive updates through reports and presentations to keep stakeholders aligned on progress, risks, and readiness for next-phase execution. B.E./ B. Tech (or) M.E./MTech in Mechanical Engineering with 4 - 6 years of relevant industrial experience in Mechanical Design Mechanical design and hardware product development experience in such as complex machinery, capital equipment, Machine Tools, Special Purpose Machines or Complex assemblies of ElectroMechanical Systems Demonstrated hands-on experience in solving Thermal or Flow problems towards hardware design. Experience in interpretation of Modeling & Simulation results Application of Material selection as qualifying criteria for manufacturing & design. Support structure optimization for AM Designs Hands-on experience on post additive manufacturing processes, such as surface finishing, quality inspections etc. Additive manufacturing processes as applicable to range of printing machines Experience in reading complex BOM, Part & Assembly level BOM architecture Hands on Experience in CAD (3D and Drawings) - Creo and/or Siemens NX. Geometric Dimensioning and Tolerancing (GD & T) Engineering change management, part release and Change order process Agility to quickly adapt product knowledge, and ability to solve Multiphysics problems Ability to work in a matrix Global organization -Interaction with cross functional technical teams. Working experience in Designing parts/assemblies in Semiconductor or Wafer fabrication equipment, in specific to Flow and Thermal problems related with process engineering will be an added advantage Knowledge of Statistics Process Control (SPC), Design of Experiments (DOE), Failure Mode Effect Analysis (FMEA), Root Cause-Corrective Action (RCCA), 8D & 5-Whys Problem solving Knowledge of different 3D slicing software, Topology optimization, FEA/CFD Simulation Experience in project management & leading technical projects

Skills Required