Job Description

Experience in design for manufacturing (DFM) including plastic injection molding, metal casting, machining, stamping, and forming Experience in electronic board design Experience in leading full life cycle projects Experience with PLM systems, engineering changes, BOM structuring, etc. Experience in design of indoor and outdoor equipment Experience in thermal, dynamical and statical design and analysis Experience in design of telecommunication/RF equipment - an advantage Experience in mentoring engineers - an advantage Perform analysis, testing, design iterations, and validation of the designs


Requirements:


Qualification: BE in Mechanical Engineering from an accredited university. ME an advantage At least 5 years of experience in electronics packaging design Strong understanding of GD&T, drawings, assembly tolerances Proficiency in SolidWorks Proficiency in writing as well as speaking in English Must be self-motivated, able to work under pressure, and multitask * Team player with strong technical and communication skills