Job Description

The position is expected to be located at Plant. For leading the Shift rework activity for SMT & MI process
This position is responsible for Shift SMT/MI rework activity and testing failure part analysis with daily analysis of critical failure to improve First pass yield
What You Will Do:
Lead SMT & MI rework/repair activity in shift
Handson experience in doing rework for Chip component, IC, BGA/LGA, connector & MI components
Knowledge of IPC 7711/7721 along with IPC 610
Debugging of ICT testing failure PCBA
Handling of NG part end to end along with documentation.
Monitor Daily first pass yield and quality issue data for SMT & THT process.
On time analysis of failure part along with CFT to improve quality rate.
Identify root cause and implement CAPA for failure along with CFT.
Monitor All KPI on daily basis & timely escalations when they arise aiming for minimum disruption
Monitor & Co-ordinate with supplier quality team for supplier related issues.
Encourage & motivate line operator for continuous improvement.
Maintain documentation as per quality standard.
Collaborate with quality control, Maintenance and SCM staff
Meet the expectation of internal & external audits.
Coordinate effective change management
What You Need:
Diploma with minimum 3 to 7 years of experience in SMT rework & repair
What We Offer:
Flexible work environment, allowing for full-time remote work globally for positions that can be performed outside a HARMAN or customer location
Access to employee discounts on world-class Harman and Samsung products (JBL, HARMAN Kardon, AKG, etc.)
Extensive training opportunities through our own HARMAN University
Competitive wellness benefits
Tuition Reimbursement
Access to HARMAN Campus Fitness Center and Cafeteria
An inclusive and diverse work environment that fosters and encourages professional and personal development
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