Brief Role : Signaling and interconnect technology selection, definition and simulation of high speed interconnects Generates accurate signal integrity analysis in PCB design Accurately model power distribution networks and noise propagation mechanisms Measure signal quality using high speed digital scopes Perform hardware validation testing and develop reports Provide feedback to package, and board design team for improvement Create design guides and routing rules for specific interfaces Analyze variation dependence and parametric optimization Validate design and correlate measurements with simulations using VNA, TDR and Oscilloscope Familiar with Signal Integrity, eye diagram, transmission line and EMI in reality and theory; Hands on experience with common interfaces, e.g. PCIe, ETH, USB Hands on experience with memory interfaces, e.g. DDR2, DDR3 Knowledge in using simulation tools, e.g. Hyperlynx Power delivery network, power supply, silicon, package or PCB design experience Additional Information Salary: Not Disclosed by Recruiter Industry:Aviation / Aerospace Firms Functional Area:Engineering Design , R&D Role Category:Senior Management Role:Head/ VP/ GM- R&D Desired Candidate Profile 10 years of experience in S.I. field Education- UG: B.Tech/ B.E. - Electrical, Electronics/ Telecommunication PG:M.
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