This role requires regular onsite presence to fulfill essential job responsibilities. Drives design, simulation, development, and implementation activities for scientific research projects leveraging device physics and electromagnetics theory, thermomechanical analysis and simulations, materials, chemistry, and process innovations to drive research on novel devices, packages, interconnects, circuits, and systems.
Investigates the feasibility of applying scientific principles and concepts to potential inventions and products years before landing on a product roadmap. Develops prototypes to demonstrate proof of concepts. Designs, fabricates, and performs etest assessment of novel devices, packages, and interconnects including DC testing, RF small signal and large signal characterization techniques, pulsing, and stressing.
Establishes etest methodologies, metrics, and criteria of a device based on required application specifications.
Provides process solutions across different production modules including lithography, etch, diffusion, CVD, PVD, CMP, and overall systems requirements, including thermomechanical, power delivery and highspeed signaling, and cost.
Owns critical process and equipment research that enable rapid device miniaturization and the mass production of integrated circuits.
Quantifies the tradeoffs between various device, circuit, and system parameters, generating and exploring novel solutions to meet and solve the demands for continued performance improvements in devices, packaging, and systems.
Develops innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
Uses hands-on approach to plan, setup, and execute experiments in collaboration with device, module, reliability, analytical labs, and TCAD across fabrication sites and quantifies and benchmarks experimental results with best known methods and literature/academia.
Develops and validates models and the necessary measurements to advance the understanding of device physics, packaging, and systems.
Leads and manages vendor engagements to support various research and development activities across devices, packages, and interconnects.
Mentors external research in academia and industry consortia to help fill Intel's internal research pipeline.
Qualifications:
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Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
+ 8+ years of experience in Foundry or EDA including Ph.D. or Master's degree
Hands-On experience in DTCO, Advanced node layouts including automation and/or circuit benchmarking experience.
Preferred Qualifications:
Virtuoso Environment
Job Type:
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Experienced Hire
Shift:
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Shift 1 (India)
Primary Location:
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India, Bangalore
Additional Locations:
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Business group:
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Intel makes possible the most amazing experiences of the future. You may know us for our processors. But we do so much more. Intel invents at the boundaries of technology to make amazing experiences possible for business and society, and for every person on Earth. Harnessing the capability of the cloud, the ubiquity of the Internet of Things, the latest advances in memory and programmable solutions, and the promise of always-on 5G connectivity, Intel is disrupting industries and solving global challenges. Leading on policy, diversity, inclusion, education and sustainability, we create value for our stockholders, customers, and society.
Posting Statement:
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All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
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N/A
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
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