Job Description

Techlanz is a Bengaluru based company founded by IIT alumni with a core focus on next generation drone battery technologies. The company provides end-to-end engineering services, product development support and advanced training & certification programs in Battery and AI space. Techlanz is also developing Battery Digital Twin in combination with the battery tech.

Position Overview

Join our Electrification hardware team to design, validate, and productize Battery Management System (BMS) electronics for Drone Applications. You will architect robust analog front-ends, protection circuits, and pack controllers; select automotive-grade components; and deliver schematics/PCBs that meet functional safety (ISO 26262), reliability (AEC-Q100/200), EMC (CISPR 25/ISO 11452), and OEM compliance requirements for series production.

Job Responsibilities

Architect smart BMS hardware from requirements through release. Execute schematic capture, component selection, and simulation (SPICE, etc.) for mixed-signal PCB designs. Create PCB layouts, ensuring adherence to best practices for signal integrity, power integrity, and EMC/EMI compliance. Design and implement robust battery monitoring, cell balancing, and protection circuits using high-precision analog front-ends (AFEs) and microcontrollers. Conduct comprehensive design-for-manufacturing (DFM), design-for-test (DFT), and failure mode and effects analysis (FMEA). Develop and execute rigorous hardware validation and verification plans, including functional, environmental, and stress testing. Design to ISO 26262 hardware safety goals (ASIL allocation, safety mechanisms, diagnostics coverage) and generate work products (HARA inputs, FMEDA data to support system teams). Select and integrate automotive-grade components (BMS AFE/monitor ICs, shunts/Hall sensors, isolated drivers, power supplies) ensuring AEC-Q qualification and derating compliance. Own PCB schematic/stack-up/layout (creepage/clearance, Kelvin sensing, star-grounds, guard rings, differential routing) and run SPICE/thermal simulations prior to build. Plan and execute V&V for EMC/EMI; drive design changes to pass at component and vehicle level. Optimize hardware designs for low power consumption, thermal management, and long-term reliability. Implement robust pack power stages (contactor drivers, pre-charge circuits, bleed/balance paths) and coordinate safe states for faults (SCD/OC/OV/UV/OT). Bring-up and characterize prototypes using scopes, power analyzers, SMUs, battery cyclers; create test plans, logs, and clear DfX actions (DFM/DFT/DFR). Integrate comms interfaces with firmware teams--Drone CAN, SPI/IC, UART, BLE; define diagnostics, boot-loaders, and pack-level serviceability hooks. Deliver manufacturing-ready documentation (BOM with AML, fab/assembly notes, test fixtures, EOL criteria) and support PPAP/APQP with suppliers. Perform design risk analysis (FMEA/FMECAs), support safety case evidence, and contribute to compliance reviews and audits.

Qualifications, Experience, Skills

B.E./B.Tech or M.E./M.Tech in Electrical/Electronics (or equivalent). 1-3 years of hands-on experience designing BMS or safety-critical automotive power electronics (48-800 V). Proven experience with BMS monitor/AFE ICs (e.g., TI BQ769x2 family, ADI LTC6811/6813): architecture selection, cell-sense front-end design, and balancing topologies. Strong PCB design skills in Altium/KiCAD: multilayer stack-ups, HV spacing rules, analog precision routing, and power integrity. Practical EMC/EMI design and debug: filtering, shielding, ground strategies; familiarity with CISPR 25 and ISO 11452 test methods. Knowledge of automotive electrical transients and protections (TVS, LC filters, surge/load-dump per ISO 7637-2). Comfortable with CAN/CAN FD, SPI, IC; ability to specify diagnostics and support firmware/HIL integration. Knowledge of GPS, GNSS, BLE, and other connectivity modules Lab proficiency: Oscilloscopes, Multimeter, DAQs, power analyzers, battery cyclers; safe HV handling and ESD practices. Familiarity with functional safety processes (ISO 26262), FMEA/FMEDA, requirements traceability tools (e.g., Polarion/DOORS). Nice to have: Experience with cell modeling/SOC-SOH estimation collaboration, thermal design, conformal coating/sealing (IP ratings), and supplier PPAP/APQP.

Skills

Knowledge of BMS, ISO 26262, CAN, Altium Designer/KiCAD /Eagle, EMC/EMI, PCB Design, Cell Balancing, ISO 7637-2, FMEA, SPICe Simulation e.g. Pspice/TINA.

Why Join Us?

Be part of a fast-growing, IIT alumni-founded company driving innovation in next-gen battery and AI technologies. Work on cutting-edge projects in EVs, drones, and digital twin solutions with real-world impact. Gain cross-functional exposure across engineering, product development, and R&D. Access to advanced training, certifications, and mentorship to accelerate your career growth. Collaborative, innovative, and learning-focused culture where your ideas matter.
If you are ready to take on this challenge and start a rewarding career with Techlanz, we encourage you to apply now!

https://www.techlanz.com/careers/68d4e9c902af3a2c70c72a92

Job Types: Full-time, Fresher

Pay: ?300,000.00 - ?500,000.00 per year

Work Location: In person