Job Description

Boeing is the world\'s largest (Per Boeing LinkedIn page) aerospace company and a leading provider of commercial airplanes, defense, space, and security systems, and global services. Building on a legacy of over a century of innovation and leadership, Boeing continues to lead the way in technology and innovation, customer delivery, and investment in its people and future growth of aerospace. In India, Boeing has been a strong partner to the Indian aerospace and defense sectors for more than 75 years. People at Boeing have been supporting mission readiness and modernization of India\'s defense forces, and enabling connected, safer, and smarter flying experiences, in the sky, in the seas, and in space. Technology for today and tomorrow The Boeing India Engineering & Technology Center (BIETC) is a 3000+ diverse engineering workforce that contributes to global aerospace growth. Our engineers deliver cutting-edge R&D, innovation, and high-quality engineering work in global markets, and leverage new-age technologies such as AI/ML, IIoT, Cloud, Model-Based Engineering, and Additive Manufacturing, shaping the future of aerospace. People-driven culture At Boeing, we believe creativity and innovation thrives when every employee is trusted, empowered, and has the flexibility to choose, grow, learn, and explore. We offer variable arrangements depending upon business and customer needs, and professional pursuits that offer greater flexibility in the way our people work. We also believe that collaboration, frequent team engagements, and face-to-face meetings bring diverse perspectives and thoughts - enabling every voice to be heard and every perspective to be respected. No matter where or how our teammates work, we are committed to positively shaping people\'s careers and being thoughtful about employee wellbeing. At Boeing, we are inclusive, diverse, and transformative. With us, you can create and contribute to what matters most in your career, community, country, and world. Join us in powering the progress of global aerospace. Boeing India Engineering seeks Associate Electronics Design and Analysis Engineer to support the Hardware Design Capabilities organization across multiple product lines and platforms like Satellites, space and aviation and to join their team in Bangalore, India . Primary Responsibilities: Understands the Card Design and development of state-of-the art electronics using DO254 processes and necessary documentation for the same. Duties will be architecting and creating Hardware design and verification plans, detailed design, requirements decomposition and testing and integration of hardware. Setup, review and release Hardware Design Plan, Hardware Validation Plan, Hardware Verification Plan and align them to Plan for Hardware Aspects of Certification Responsible fordigital design, timing, worst case circuit analysis, and communications systems Ability to simplify circuits containing flash, processors, FPGAs and memories to explain the underlying concepts clearly Develop architecture with circuits involving SERDES, Audio-Video and Intel architectures Develop high speed interface based circuit designs and work with mechanical teams for thermal analysis and electromechanical packaging. Basic Qualifications (Required Skills and Experience) Bachelor\'s in engineeringdegree or higher is required. Defined Hardware Design workflow with integration of PLDs and its usage in DO254 life cycle Experience on processor-based architectures and design interfaces. Experience as a design architect to contribute towards safety and reliability design and analysis requirements Electromagnetic Interference (EMI)Analysis experience. Good understanding of grounding and shielding concepts, chassis design. Experience managing component/system level-electronics design and development Design and Testing of DDR3/4, PCIe gen3, USB3, LPDP, MIPI, SATA, Ethernet and I2C/SPI/UART buses Selection of components to be used in Avionics Electronics Designs, like but not limited to, DDR, memory, storage media flash, ethernet controllers. Good understanding of ARINC 429, ARINC 818 and MIL 1553. Experience with Power Integrity analysis, Hyperlynx SI, Timing Analysis. Experience with Mentor suite of eCAD tools Experience with Manufacturing of Electronic Assemblies (manufacturing readiness assessments, Rapid Prototyping, dfmat, electronics manufacturing) Basic understanding on electronic manufacturing processes which include PCB fabrication, component assembly, ICT, FCT, EOL etc. Preferred Qualifications (Desired Skills/Experience): Preferred to have candidates who have knowledge upon high reliability system designs (redundancy, single event failures, safety flow analysis and similar concepts) Experience and development and certification to DO-160, DO-254, MIL-STD 810 Experience in Giving inputs and accepting designs for electromechanical packaging, reviewing concepts like thermal, structural, interference, CG, material, human factor analysis outputs. Typical Education & Experience: Education/experience typically acquired through advanced education (e.g. Bachelor) and typically 3-5 years of related work experience or an equivalent combination of education and experience (e.g. Master with related work experience, etc.). Relocation: This position offers relocation based on candidate eligibility. Export Control Requirements: Not an export control position Equal Opportunity Employer: We are an equal opportunity employer. We do not accept unlawful discrimination in our recruitment or employment practices on any grounds including but not limited to color, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military and veteran status, or other characteristics covered by applicable law. We have teams in more than 65 countries, and each person plays a role in helping us become one of the world\'s most innovative, diverse and inclusive companies. Applicants are encouraged to share with our recruitment team any accommodations required during the recruitment process.

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